Thursday, September 26, 2013

New York Comic Con 2013


Insight Editions is pleased to announce its lineup for the eagerly anticipated 2013 New York Comic Con (October 10–13, Booth #1564). Not only will we have specials, giveaways, and promotions, but everything in the booth will be 30% off. We will also have in-booth signings of some of this year’s blockbuster titles and we’ll debut some new projects, including:




We’re very excited to announce that Diablo III: Book of Tyrael (Pub. Date: October 29) will be signed at NYCC on Saturday, October 12th at 11:00 a.m. in our booth! Join Doug A. Gregory from art direction, illustrator Joseph Lacroix, and Blizzard lead story developer Micky Neilson.

One of the most exciting and visceral action role-playing games in recent memory, Diablo® has become a worldwide gaming phenomenon. Diablo III: Book of Tyrael takes fans even further into the universe with a detailed and beautifully crafted artifact that focuses on the renowned champion Tyrael. As a former archangel of the High Heavens, he ranks among the most important and influential characters in the Diablo franchise. Here, in this illustrated and comprehensive tome, he reveals never-before-known secrets about the history of the world, the dark threats that yet face mankind, and his decision to join the ranks of humanity as a mortal. Featuring stunning original art throughout, this beautifully illustrated follow-up to Diablo III: Book of Cain will also feature letters from Leah and additional fragments of Cain’s writings, all curated by Tyrael as he weaves together a complex and fascinating story for the members of the Horadrim.

Diablo III: Book of Tyrael also features a fully removable illustration of the Leoric family and other influential characters from Old Tristram, including Deckard Cain, Prince Albrecht, Archbishop Lazarus, King Leoric, Prince Aidan, Queen Asylla, Leah, and Adria. This reversible image demonstrates their normal appearances on one side, along with a representation of their dark fates on the other.

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